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16 products

Optical Fabrication Accessories

Clear All Filters xoptical polishing xOptics & Optical Fabrication xOptical Fabrication Accessories x
HASTILITE MOV 850
HASTILITE MOV 850
Universal Photonics Inc.
  • Type: Polishing Material and Pads
  • Density (g/mL): 1.4 - 1.6
  • Particle Size D50 (μm): 0.3 - 0.5
  • Particle Size D99 (μm): < 2
Premier Product
Gugolz Polishing Pitch
Gugolz Polishing Pitch
Meller Optics Inc.
  • Type: Polishing Pitch
  • Burn Point: 278° to 252°
  • Flash Point: 246° to 213°
  • Melting Point: 72°C to 87°C
S3 Super Smooth Surfactant
S3 Super Smooth Surfactant
Universal Photonics Inc.
  • Type: Additives
  • Appearance: Pale Blue Liquid
  • pH: 6.0 - 7.5
  • Size Availability: 1pt, 1gl, 5gl
EVERFLO Surfacing Additive
EVERFLO Surfacing Additive
Universal Photonics Inc.
  • Type: Additives
  • Density (g/mL): 0.95 - 1.00
  • Freezing Point (°F): 26 - 28
  • pH: 6.4 - 8.6
Alumina Polishing Compounds
Alumina Polishing Compounds
Meller Optics Inc.
  • Type: Abrasives
  • Deagglomerated Grade: Microlux-RZ
  • Regular Grade: Microlux-R
CP PITCH for Continuous Polishing
CP PITCH for Continuous Polishing
Universal Photonics Inc.
  • Type: Polishing Pitch
  • CP55 Softening Point (°C): 52 - 55
  • CP64 Softening Point (°C): 68 - 72
  • CP73 Softening Point (°C): 77 - 80
UNICER 1000 Cerium Polish
UNICER 1000 Cerium Polish
Universal Photonics Inc.
  • Type: Polishing Material and Pads
  • Appearance: Off White, Powder
  • Cerium Oxide Content (%): ≥ 58
  • Particle Size D50 (μm): 0.8 - 2.0
SC-955 PAD
SC-955 PAD
Universal Photonics Inc.
  • Type: Polishing Material and Pads
  • Density (g/cm3): 0.30 - 0.42
  • PSA Backing: Yes
  • Removal Rate (µm/min): 0.68
HASTILITE Poly Silicon Polish
HASTILITE Poly Silicon Polish
Universal Photonics Inc.
  • Type: Polishing Material and Pads
  • Particle Size D50 (µm): 0.110 - 0.140
  • Particle Size D99 (µm): < 0.389
  • pH: 1 - 3
HASTILITE Nano Silicon Polish
HASTILITE Nano Silicon Polish
Universal Photonics Inc.
  • Type: Polishing Material and Pads
  • % Solids: 15 - 20
  • Particle Size D50 (μm): 0.110 - 0.140
  • Particle Size D99 (μm): < 0.389
HASTILITE Ceria-Base Polish
HASTILITE Ceria-Base Polish
Universal Photonics Inc.
  • Type: Polishing Material and Pads
  • Particle Count D50 (μm): 0.4 - 0.7
  • pH: 6 - 7
  • PO Density (g/mL): 1.50 - 1.68
TJX438 Ceria Slurry
TJX438 Ceria Slurry
Demeter Technologies Inc.
  • Type: Polishing Material and Pads
  • Concentration: 30%
  • D50 (µm): 0.5 - 0.7
  • D97: <4.0
TPJ825 Ceria Powder
TPJ825 Ceria Powder
Demeter Technologies Inc.
  • Type: Polishing Material and Pads
  • CeO2/TREO: >60%
  • Concentration: 100%
  • D50 (µm): 1.2 - 1.6
TJP621 Ceria Powder
TJP621 Ceria Powder
Demeter Technologies Inc.
  • Type: Polishing Material and Pads
  • CeO2: 65-72 %
  • Concentration: 100%
  • D50 (µm): 1.8 - 2.2
DZr-P Zirconia Slurry
DZr-P Zirconia Slurry
Demeter Technologies Inc.
  • Type: Polishing Material and Pads
  • Color: Pink
  • Concentration: 25%
  • D50 (µm): 1.4 - 1.6
D605S Ceria Slurry
D605S Ceria Slurry
Demeter Technologies Inc.
  • Type: Polishing Material and Pads
  • Concentration: 50%
  • D50 (µm): 0.8 - 1.0
  • D97: 5.0
Optical Fabrication Accessories Products


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