Search
Menu
PI Physik Instrumente - Revolution In Photonics Align LW LB 3/24

Chip-Sale Package

SemiLEDs Corp.Request Info
 
Facebook X LinkedIn Email
The ReadyMount Enhanced CSP (chip-scale package) from SemiLEDs is a series of packaged white emitter surface-mount components that combine Enhanced Flip chip and ReadyWhite phosphor technology.

The chip can produce outputs of up to 300 lumens at 1A using an input power of 3 W, and is available in color temperatures ranging from 2700 to 10,000 K, with color rendering indices up to 90 minimum in a 145° field of view.

Applications include indoor and outdoor lighting, architectural lighting, torches/flashlights, mobile device flashes and LCD backlighting.


Published: August 2014
REQUEST INFO ABOUT THIS PRODUCT
* First Name:
* Last Name:
* Email Address:
* Company:
* Country:
Message:


When you click "Send Request", we will record and send your personal contact information to SemiLEDs Corp. by email so they may respond directly. You also agree that Photonics Media may contact you with information related to this inquiry, and that you have read and accept our Privacy Policy and Terms and Conditions of Use.

Register or login to auto-populate this form:
Login Register
* Required

Asia-PacificpositioningLEDsProductsSemiLEDs

We use cookies to improve user experience and analyze our website traffic as stated in our Privacy Policy. By using this website, you agree to the use of cookies unless you have disabled them.