Master Bond Inc. has developed a two-component epoxy adhesive for high-performance bonding applications such as potting and encapsulating electronic components and bonding optical elements. The company says EP30 offers low viscosity, outstanding chemical resistance, dimensional stability, hardness and optical clarity. It cures at ambient temperatures or at a more accelerated rate by using moderate heat. This substance adheres to a variety of substrates, including metals, ceramics, glass and many plastics. The lap-shear strength typically exceeds 3000 psi for aluminum-to-aluminum bonds.