Jan 2002Dexter Research Center Inc.Request Info
Dexter Electronic Materials offers a low-viscosity UV-light-cure adhesive for optical pathway bonding applications. Hysol UV 702 wicks into and fills gaps of <25 µm and cures in seconds upon high-intensity UV exposure. The adhesive forms an impact-resistant bond between transparent parts and surfaces, including quartz, silicon, ceramic and some plastics. The company says it requires no primer and has been modified to retain adhesion after exposure to damp heat for more than 2000 h. The material is suitable for use with V-groove assemblies, and for bonding lenses, prisms and other components where index of refraction is important.