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WAFER ETCHING

Photonics Spectra
Apr 2002
VeecoRequest Info
 
Solid State Equipment Corp. offers single wafer etch processors that perform end-point detection and wet etching. These Trilennium wafer processors have a color CCD processor with a programmable, statistically based sequence that measures the color of the etched surface to determine completion of the process. Chemical blending produces dilu-tion ratios from 10:1 to more than 10,000:1 with ±2% accuracy. Onboard blending and dilution allows systems to operate from internal stores of concentrated chemistry, reducing space and chemical handling requirements.


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