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PACKAGING, ASSEMBLY

Photonics Spectra
Jun 2002
ATS Automation Tooling Systems Inc.Request Info
 
The Flexsys family of standardized automated manufacturing systems, available from Automation Tooling Systems Inc., includes solutions for advanced packaging and assembly in opto- and microelectronics manufacturing. Each system accommodates multiple operations on a single platform for improved yields. The Flexsys 1000 is semi-automated and achieves submicron accuracy in applications such as active and passive alignment and epoxy dispensing and curing. The 2000 model is fully automated for high-volume production, and the 3000 model is a high-speed die bonder for thermal-compression and flip-chip bonding. The 4000 ultrahigh-precision system features a data-driven software design for flexibility and submicron accuracy in vision-guided placement and alignment applications.


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