The Flexsys family of standardized automated manufacturing systems, available from Automation Tooling Systems Inc., includes solutions for advanced packaging and assembly in opto- and microelectronics manufacturing. Each system accommodates multiple operations on a single platform for improved yields. The Flexsys 1000 is semi-automated and achieves submicron accuracy in applications such as active and passive alignment and epoxy dispensing and curing. The 2000 model is fully automated for high-volume production, and the 3000 model is a high-speed die bonder for thermal-compression and flip-chip bonding. The 4000 ultrahigh-precision system features a data-driven software design for flexibility and submicron accuracy in vision-guided placement and alignment applications.