Electro Scientific Industries Inc. has launched a laser micromachining system for dicing wafers and drilling vias in silicon wafers. The model 2700 can cut out die with either straight or curved cuts, allowing parts to be nested closely together and making the system suitable for dicing array waveguide gratings. It cuts silicon without using water, enabling it to dice released MEMS wafers. The system can drill 25-µm-diameter vias through 750-µm-thick silicon wafers. The company says the compound beam positioner provides accurate laser spot placement while traveling at high speeds.