Request InfoGT Advanced Technologies, Advanced Materials GroupCrystal Systems' fixed abrasive slicing technology uses a pack of wires with diamond particles to slice silicon, sapphire, silicon carbide and other materials that require precise fabrication. For example, this technique can be used to slice sapphire wafers for light-emitting diodes. The slicers can rotate workpieces at speeds of up to 5000 rpm. The company says this technology provides high wafer accuracy, low kerf loss, low damage, and cutting rates that are three times higher than those achieved by other methods.See full productRelated content from Photonics MediaPRODUCTSPhotonics.com 4/14/2023Machine Vision SoftwareVersion 5.3 of the MERLIC machine vision software from MVTec Software GmbH includes a deep learning, object-detection feature and enhanced user-friendliness for beginner and expert users. 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