Sep 2002Logitech Ltd.Request Info
Logitech offers a precision lapping machine for use with delicate and brittle materials, such as III-V and II-VI semiconductors and sapphire wafers, that must be processed in bulk to precise tolerances. The Next Generation System is designed to handle high-precision angle polishing for producing optical network components, including arrayed waveguides, and for thinning substrates for integrated circuits. It has four automated load/unload workstations with processing arms that can be individually lowered or removed. The company says this allows different batches of materials/components to be run together on the same processing plate for reduced downtime and increased efficiency.