Request InfoLogitech Ltd.Logitech offers a precision lapping machine for use with delicate and brittle materials, such as III-V and II-VI semiconductors and sapphire wafers, that must be processed in bulk to precise tolerances. The Next Generation System is designed to handle high-precision angle polishing for producing optical network components, including arrayed waveguides, and for thinning substrates for integrated circuits. It has four automated load/unload workstations with processing arms that can be individually lowered or removed. The company says this allows different batches of materials/components to be...See full productRelated content from Photonics MediaWEBINARSPhotonics.com 1/12/2023A Proven, Portable, and PIC-Based Methodology for Cultivating a Next-Generation WorkforceWith the passage of the CHIPS and Science Act and growing demand for photonic integrated circuit technology, the semiconductor industry is once again gaining momentum. But even as the U.S. rebuilds...Photonics.com 6/30/2021European Photonics Manufacturing Services Funded by ECThis event is supported by the European initiatives presented and is moderated by EPIC, the European Photonics Industry Consortium. The European Commission is helping companies access the...Photonics.com 7/20/2023Motorized and Calibrated Lenses for Machine Vision ApplicationsMany applications have benefited from motorized varifocal lenses that allow automatic or remote adjustment of focus distance and field of view. Applications may need to change the focal length or...Photonics.com 1/9/2023Innovations in Ultrashort-Pulse and RF-Excited CO2 Lasers Expand Materials Processing ApplicationsIndustrial laser materials processing is constantly evolving. Industries as varied as pharmaceutical, consumer electronics, automotive, aerospace, and textiles, among others, have benefited from new...