Leica Microsystems AG, Microscopy Div.New software from Leica Microsystems AG has extended the capabilities of the company's INS3300 modular inspection and review station for applications such as direct-write lithography and process control of 300- and 200-mm wafers. SpotCheck automates inspection of critical sites on wafers for process irregularities and for system defects, such as overlay shift and those already on the reticle or mask. It detects particles, extra pattern and probe mark position errors. The company says that when used with its optional ADC NT/DUV software, the device can classify defects automatically, quickly...See full productRelated content from Photonics MediaPRODUCTSPhotonics Spectra September 2023 IssueLow-Noise Water CoolerThe mRC-C-1000-100/240 low-noise recirculating chiller from AMS Technologies AG features a cooling capacity of 1000 W. 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Land Medal; Amplitude Laser Names President: People in the News: 04/12/23Optica awarded the Edwin H. Land Medal to Susana Marcos, the David R. Williams director of the Center for Visual Science at the University of Rochester. Marcos is a co-founder of 2EyesVision SL and a...PHOTONICS HANDBOOK ARTICLESPhotonics HandbookBroadband Spectrophotometry: A Fast, Simple, Accurate ToolDesigning devices that incorporate ultrathin films is an important means of enhancing yields. However, characterizing ultrathin films provides a challenge for mainstream metrology tools such as...Photonics HandbookDiamond Machining: Ultraprecision Machine TechnologyUltraprecision machining can be defined in general terms as the removal of material from a substrate utilizing a machine tool that operates at a resolution of 10 nm (0.4 μin.) or less. 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