Dec 2002Newport CorporationRequest Info
The MRSI-5005 advanced packaging work cell is offered by Newport Corp. This packaging system combines GaAs die handling and flip-chip bonding for component attachment applications with MEMS and with RF, microwave and millimeter-wave modules. It also is suitable for thermal compression flip bonding. Features include placement accuracy of ±5 µm, 360° random die orientation, substrate alignment, programmable controlled force and automatic tip changing. The MRSI-5005 accepts parts in cassette-to-cassette handling mode, wafer pickup, waffle and gel packs, and tape feeders.