Request InfoMaster Bond Inc.Master Bond Inc. has developed Polymer System X5HT -- a one-component contact-type adhesive/sealant with a service temperature range of -75 to 500 °F. Bonding methods include hot presses or vented ovens with assemblies clamped or fixtured. Curing requires 15 to 30 min in a properly vented oven at 300 to 400 °F, with applied pressure generally less than 50 psi, depending on the hardness of the substrates being bonded. It adheres to a variety of substrates, including metals, polymers, composites, glass and ceramics. It has typical lap-shear strength values of 1400 psi for cold rolled...See full productRelated content from Photonics MediaPRODUCTSPhotonics Spectra August 2023 IssueBatch PhotoreactorThe Solstice™ temperature-controlled batch photoreactor from Uniqsis Ltd. is designed for small-scale photochemical reactions. 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