The Accu-Cut model 5255 from Aremco Products Inc. is designed for diamond dicing of ceramic, ferrite, quartz and semiconductor substrates such as silicon, GaAs and bismuth telluride up to 6 x 6 x 1 in. thick. The programmable system can be used with metal- and resin-bonded diamond wheels up to 4.5 in. in diameter and has a variable-speed spindle with 0 to 10,000 rpm control. Menu-driven software is included, which enables users to enter a cut profile for repetitive dicing over a 6-in. range.