Expert application system (Easy) software released by Rudolph Technologies Inc. enhances the capabilities of the company's MetaPulse and MetaPulse-II opaque film metrology line to cover 90-nm chip manufacturing processes. The software is suitable for applications including in-line electroplate edge profiling, residual copper/barrier detection after chemical mechanical planarization, and copper/interlevel dielectric dishing. Manufacturers can detect defects during production to avoid reduced yield of chips on the wafer's edge and to prevent chemical mechanical planarization-related problems. If planarization does occur, the system checks for traces of residual copper and barrier, preventing the copper lines from shorting together, which would produce a defective die. Easy also determines whether the measurement site consists of copper or interlevel dielectric dishing and applies the appropriate model for each.