Mar 2004InnoLas Laser GmbHRequest Info
InnoLas GmbH has added to its ILS500 line of laser systems for micromaterials processing. The ILS500P, designed for making prototypes of printed circuit boards, performs numerous processing steps in a single operating cycle, including laser drilling of microvias (40 to 250 µm in diameter), direct structuring of metallic and organic layers, creation of ultrafine conductor structures and cutting of flexible, rigid-flexible and thin multilayers. The device employs a UV solid-state laser with an average power of 7 W at a wavelength of 355 nm and with a pulse repetition frequency of 100 kHz. A second laser can be integrated to enable processing boards made of different materials. An X-Y table and a galvoscanner support the system's motion.