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SUBSTRATE POLISHERS

Photonics Spectra
May 2004
Engis UK Ltd.Request Info
 
SUBSTRATE POLISHERS Engis (UK) Ltd. offers the Microtech CMP-D polishing systems for the surface planarization and polishing of compound semiconductor, sapphire, silicon carbide and other substrates. The polishers employ graded micron-scale diamond in specially formulated slurries. The company says that the equipment requires shorter processing times and uses less-expensive, less-toxic and fewer consumables than traditional approaches, resulting in higher productivity, lower costs and simpler processing.


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GLOSSARY
compound semiconductor
A semiconductor made up of two or more elements, in contrast to those composed of a single element such as germanium or silicon. In a III-V semiconductor, for example, one or more elements having three valence electrons (gallium, for instance) are combined with one or more having five (arsenic).
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