Fused Silica Wafers

Sydor Optics Inc.

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From 0.2-mm Thick

ROCHESTER, N.Y., June 3 -- Sydor Optics now manufactures wafers up to 300 mm in diameter -- wafers from 0.2-mm thick, size-dependent, with thickness tolerances starting at +/-0.003 mm. Standard wafer diameters include 50, 100, 150, 200 and 300 mm. They are usually delivered in less than two weeks. Wafers with different diameters, thicknesses and locating flats are also available.

Sydor said its wafers are processed using double-sided equipment and have under 20 seconds of wedge with transmitted wavefront error under one wave, except for wafers under 1-mm thick, which have slightly more relaxed surface flatness, transmitted wavefront and wedge tolerance.

Although stock wafer blank material is Corning 7980 fused silica, Sydo said it also makes fused silica out of Heraeus Amersil and Schott Lithotec fused silicas as well as other, nonfused silica materials such as Borofloat, BK-7 and B270. The wafer blanks are wire sawed to provide the best flatness, and the outer diameter is fine ground with loose abrasive, which aids in providing better cosmetics than actually specified, Sydor said.

For more information, visit: www.sydor.com; e-mail: [email protected]

Sydor Optics
1 Blossom Road
Rochester, NY 14610-1009
Phone: 585-271-7300 x107
Fax: 585-271-7309

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Published: June 2004