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  • Solder Paste
Oct 2004
Indium Corp.Request Info
Water-Soluble, Pb-Free
CLINTON, N.Y., Oct. 29 -- To meet the high demand of water-soluble solder paste users who need to comply with the Pb-Free (lead-free) requirements, Indium Corp. of America has developed Indium3.1, a water-soluble, Pb-free solder paste with exceptional printing, ideal for fine-pitch applications. Its unprecedented stencil life virtually eliminates solder paste waste.

Indium3.1 exhibits excellent wetting under both air and nitrogen reflow atmosphere. Any residue is easily cleaned with water. The resultant solder joints are shiny and smooth, including those of ultrafine-pitch components.

Indium3.1 also features a wide reflow window, outstanding slump resistance, low voiding and low foaming. Standard packaging for stencil printing applications is 500-g jars and 700-g cartridges.

Indium3.1 is backed by Indium Corp.'s internationally experienced engineers, who provide in-depth technical assistance and expert advice in solder properties.

For more information, visit:; e-mail:

Indium Corp.
34 Robinson Road
Clinton, NY 13323
Phone: (315) 381-7554


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Metal used in components of the crystalline semiconductor alloys indium gallium arsenide (InGaAs), indium gallium arsenide phosphide (InGaAsP), and the binary semiconductor indium phosphide (InP). The first two are lattice-matched to InP as the light-emitting medium for lasers or light-emitting diodes in the 1.06- to 1.7-µm range, and the last are used as a substrate and cladding layer.
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