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PACKAGE INSPECTION

Photonics Spectra
Nov 2004
Logos Systems InternationalRequest Info
 
The latest member of Logos Systems International's family of inspection systems for chip-scale packages and ball grid arrays has been released. Octaveo Model 50CSP comes with a 1.3-megapixel on-axis camera and adjustable optics for inspecting solder balls ranging from 0.1 to 0.4 mm in diameter on chips varying from 1 to 7 mm on a side. The software can handle arrays of up to 30 × 30 balls, with any amount of site depopulation desired. The 3-GHz Pentium 4 embedded PC processes chips at a rate of five to 10 parts per second, depending on the test selected.


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