Request InfoLogos Systems Int'lThe latest member of Logos Systems International's family of inspection systems for chip-scale packages and ball grid arrays has been released. Octaveo Model 50CSP comes with a 1.3-megapixel on-axis camera and adjustable optics for inspecting solder balls ranging from 0.1 to 0.4 mm in diameter on chips varying from 1 to 7 mm on a side. The software can handle arrays of up to 30 × 30 balls, with any amount of site depopulation desired. The 3-GHz Pentium 4 embedded PC processes chips at a rate of five to 10 parts per second, depending on the test selected.See full productRelated content from Photonics MediaWEBINARSPhotonics.com 7/19/2022Barcode Reading: The Not-So-Obvious Path to Deep Learning SolutionsWitherspoon discusses how advancements in deep learning technologies are transforming vision-based inspection systems. He shows how others are successfully using barcode reading as a springboard to...Photonics.com 7/20/2023How Inspection Applications, Embedded Systems, and Other Vision Applications Are Optimized with Optical FiltersMachine vision grade optical filters have become an essential part of contemporary machine vision systems, offering extensive utility across various applications such as cutting-edge factory...Photonics.com 4/19/2023Key Considerations When Utilizing Laser-Induced Breakdown SpectroscopyLaser-induced breakdown spectroscopy (LIBS) is a fast, nondestructive analytical technique that uses a laser to generate a plasma on the surface of a sample, producing emission spectra that can be...Photonics.com 10/22/2019What You Need to Know About an AM Laser’s Personality: Power Is Not the Complete StoryMost of us are familiar with the many benefits that laser-based additive manufacturing brings to manufacturing, including reduced tooling costs, easier testing of complex geometries, and faster time...PHOTONICS BUYERS' GUIDE CATEGORIESNoncontact Optical Inspection SystemsNoncontact Automatic Inspection SystemsQuality Control and Inspection SystemsX-Ray Inspection Systems