Close

Search

Search Menu
Photonics Media Photonics Buyers' Guide Photonics EDU Photonics Spectra BioPhotonics EuroPhotonics Industrial Photonics Photonics Showcase Photonics ProdSpec Photonics Handbook
More News
SPECIAL ANNOUNCEMENT
2016 Photonics Buyers' Guide Clearance! – Use Coupon Code FC16 to save 60%!
share
Email Facebook Twitter Google+ LinkedIn

LED WAFER SCRIBING

Photonics Spectra
Jan 2005
IPG Photonics, Microsystems Div.Request Info
 
LED WAFER SCRIBING JPSA Laser has announced 2.5-µm LED dicing kerfs that achieve a 50% reduction in cut widths to increase both die yield per wafer and throughput. The narrower scribe is characterized by a sharper V-groove profile that allows a shallower cut to break more readily and to increase the wafer-per-hour specification. Specially configured UV diode-pumped solid-state laser system optics are used to achieve the narrower cuts. The company says that process improvements are the result of the enhanced laser and optics, as well as the ability to manipulate subtle optical effects to achieve a small on-target energy distribution with a lower heat-affected zone, while maintaining a long working distance and depth of field.


REQUEST INFO ABOUT THIS PRODUCT

* Message:
(requirements, questions for supplier)
Your contact information
* First Name:
* Last Name:
* Email Address:
* Company:
Address:
Address 2:
City:
State/Province:
Postal Code:
* Country:
Phone #:
Fax #:

Register or login to auto-populate this form:
Login Register
* Required
GLOSSARY
wafer
A cross-sectional slice cut from an ingot of either single-crystal, fused, polycrystalline or amorphous material that has refined surfaces either lapped or polished. Wafers are used either as substrates for electronic device manufacturing or as optics. Typically, they are made of silicon, quartz, gallium arsenide or indium phosphide.
Terms & Conditions Privacy Policy About Us Contact Us
back to top

Facebook Twitter Instagram LinkedIn YouTube RSS
©2016 Photonics Media
x Subscribe to Photonics Spectra magazine - FREE!