Jun 2005Avo Photonics Inc.Request Info
A lead-free TEC-to-Package assembly process has been developed by Avo Photonics. It includes solder bonding of the thermoelectric (TE) cooler within a nonoxidizing inert gas environment that results in void-free coverage. Surface acoustic microscopy testing verifies void-free results. The company says that the process produces good thermal conductivity across the interface as well as rugged bond strengths. For TE coolers that don't have wire-bond posts, the company trims, forms and simultaneously reflows the solder to bond the leads to the package.