FLIP-CHIP MATERIAL
Henkel Adhesives
Hysol FP4548FC is a high-purity liquid epoxy encapsulant material from Henkel Corp.’s Electronics Div. that is designed as an underfill for flip-chip devices that require crack and fracture resistance. Its low coefficient of thermal expansion and low shrinkage properties make it suitable for low k die applications. When fully cured, the material creates a rigid, high-strength seal that dissipates solder joint stress, extends thermal cycling performance and simplifies assembly. It is compatible with lead-free manufacturing requirements and is qualified for JEDEC Level 3/260 °C.
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/Buyers_Guide/Henkel_Adhesives/c6009
Published: November 2005