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WAFER MEASUREMENT

Photonics Spectra
Mar 2006
Tamar Technology (See Rudolph Technologies)Request Info
 
For measuring the mechanical properties of MEMS, standard and ultrathin wafers, LCDs, and flat panel displays, ceramics and other substrates, Tamar Technology has unveiled the WaferScan. It uses a proprietary noncontact optical stylus profiler that measures thickness, bow and warp. A 3-D map is generated to display thickness and top and bottom surface profiles. The instrument can be supplied as a turnkey tool or as an OEM measurement probe for integration into equipment or in-process applications. It accepts wafers from 10 µm to 100 mm thick and is offered with a ±500-µm and a ±100-µm measurement range for bow and warp, with resolution of 0.1 and 0.05 µm, respectively.


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