For measuring the mechanical properties of MEMS, standard and ultrathin wafers, LCDs, and flat panel displays, ceramics and other substrates, Tamar Technology has unveiled the WaferScan. It uses a proprietary noncontact optical stylus profiler that measures thickness, bow and warp. A 3-D map is generated to display thickness and top and bottom surface profiles. The instrument can be supplied as a turnkey tool or as an OEM measurement probe for integration into equipment or in-process applications. It accepts wafers from 10 µm to 100 mm thick and is offered with a ±500-µm and a ±100-µm measurement range for bow and warp, with resolution of 0.1 and 0.05 µm, respectively.