Request InfoTeledyne Advanced Electronic SolutionsTeledyne Microelectronics develops advanced microelectronics packaging for high-speed broadband communications, including fiber optic transmitters, receivers, multichannel transceivers and optical assemblies. The company provides low-, medium-, or high-volume miniature optoelectronic packaging design, assembly and test. It specializes in packaging ultradense microminiature devices on a variety of substrates, including LTCC, HTCC and thick/thin film. Advanced packaging techniques include flip chip, chip scale, BGA, SMT and mixed-mode manufacturing; it is ISO 9001:2000 and MIL-PRF-38534...See full productRelated content from Photonics MediaPRODUCTSPhotonics.com 3/27/2024Extended C+L-Band GrismsCoherent’s family of aberration-correcting, high-efficiency grisms and transmission gratings encompass the entire extended C+L band in a single optic for the construction of compact network...Photonics.com 6/7/2022UHD HDMI to SDI Converter ModuleThe NA4K2022 small-form-factor UHD HDMI to serial digital video (SDI) converter module from eVision Systems GmbH provides native signal processing with high image quality. 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