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  • IX200 ChromaDice Laser
Jun 2006
IPG Photonics, Microsystems Div.Request Info
HOLLIS, N.H., June 26, 2006 -- JP Sercel Associates has introduced its new IX200 ChromaDice series of laser systems, available in both DPSS (diode-pumped solid-state) and excimer ultraviolet (UV) laser configurations.

The IX200 ChromaDice DPSS version is a high-precision wafer dicing (singulation) system also suitable for wafer trimming and scribing and many other direct-write applications. Its UV DPSS laser system delivers high-speed wafer dicing and cutting with typical yields greater than 99 percent at less than $2 per wafer, according to the company. The process is tolerant of wafer warp and bow and suitable for all wafer types.

IX200-UV-Laser.jpgThe IX200 system is also available in an excimer laser version for via drilling, micromachining, thin-film patterning and many other semiconductor packaging applications, including LED liftoff. The Class 1, fully enclosed IX200 ChromaDice is available in 266 nm or 355 nm UV DPSS laser wavelengths for a wide range of process capabilities; it can achieve cuts as narrow as 2.5 µm in width, yielding as much as 24 percent more die per wafer with die yields greater than 99 percent. According to JPSA, it delivers excellent results on GaAs (gallium arsenide), silicon (Si) and other materials and scribes up to 6-in. wafers, including sapphire LED wafers.

The IX200 ChromAblate system is an excimer laser configuration. At a 248 nm wavelength, it is suitable for micromachining of Si, GaN (gallium nitride), GaAs and other IIIV materials, as well as polymers, ceramics and many others. An optional 193 nm beam delivery package is also available, useful for polymers that do not couple well with the longer UV wavelength (e.g., Pebax), as well as many of the more optically transparent materials that do not machine well under 248 nm wavelength UV laser energy, the company said.

JPSA will officially introduce the IX200 UV laser wafer processing and micromachining system in San Francisco at Semicon West 2006, July 11-13, booth 5179. For more information, visit

JP Sercel Associates
17D Clinton Dr.
Hollis, NH 03049
Phone: (603) 595-7048
Fax: (603) 598-3835
Web site:


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A contraction of "excited dimer." The term refers to an excited species made by combination of two identical atoms or molecules, one of which is excited and one of which is at a ground state.
A cross-sectional slice cut from an ingot of either single-crystal, fused, polycrystalline or amorphous material that has refined surfaces either lapped or polished. Wafers are used either as substrates for electronic device manufacturing or as optics. Typically, they are made of silicon, quartz, gallium arsenide or indium phosphide.
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