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CRYSTAL WAFERING

Photonics Spectra
Sep 1998
Valley Design Corp., HeadquartersRequest Info
 
Valley Design Corp. says it has improved its techniques for cutting, wafering and slicing glass and crystal, promising the least possible kerf loss when cutting. Instead of grinding thick blanks of material for thin wafers, the company provides savings by cutting the blanks into multiple wafers. The parts can be made as thin as 0.020 in. with a standard tolerance of 0.001 in. The as-cut finish ranges from 15 to 30 µin.


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