Request InfoValley Design Corp., HeadquartersValley Design Corp. says it has improved its techniques for cutting, wafering and slicing glass and crystal, promising the least possible kerf loss when cutting. Instead of grinding thick blanks of material for thin wafers, the company provides savings by cutting the blanks into multiple wafers. The parts can be made as thin as 0.020 in. with a standard tolerance of 0.001 in. The as-cut finish ranges from 15 to 30 µin.See full productRelated content from Photonics MediaPRODUCTSPhotonics Spectra November 2023 IssueAmplifier and Laser DriverThe FiberEdge® GN1816 and GN1848 from Semtech are linear transimpedance amplifiers and laser drivers, respectively, for short reach 400 g and 800 g data center applications. 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These components are crucial for various...Photonics Dictionaryfiber-coupled LEDA fiber-coupled LED (light-emitting diode) refers to an LED device that is optically coupled to an optical fiber for the purpose of efficient light transmission. In this configuration, the LED serves...Photonics DictionaryInGaAs photodiodeAn InGaAs photodiode refers to a photodetector device that is constructed using a semiconductor material composed of a combination of indium (In), gallium (Ga), and arsenic (As). The term InGaAs...VIDEOSPhotonics.com 3/4/2024Specifying Optical Coatings - LaCroix Precision OpticsOptical coatings modify the reflectance, transmittance, and absorptive properties of optic substrates to make them much more efficient and functional. From an optical manufacturer's perspective,...Photonics.com 8/14/2023How to Clean Spherical Lens - DayOpticsCheck out our new video tutorial on how to clean spherical lenses! 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