Low Viscosity Adhesive for Optics Bonding HACKENSACK, N.J., Nov. 28, 2006 -- Polymer System EP30-1, recently developed by industrial adhesive, sealant and coating manufacturer Master Bond Inc., is a low viscosity, two component epoxy compound for high performance fiber optics bonding, coating, potting and encapsulation. EP30-1 is formulated to cure at room temperature or more rapidly at elevated temperatures, with a four-to-one mix ratio by weight. This compound is 100 percent reactive and does not contain any solvents or other volatiles. It is especially recommended where low viscosity is required for ease of application and bonded, coated or cast assemblies must exhibit superior dimensional stability, the company said. Linear shrinkage after cure is exceptionally low -- 0.0003 inches/in. The cured epoxy resin compound has a spectral transmittance of over 97 percent (3100-9000 A). Polymer System EP30-1 produces high-strength rigid bonds, coatings and castings with excellent chemical resistance to water, oil and most organic solvents, over the exceptionally wide temperature range of -60 °F to more than 250 °F. Adhesion to both similar and dissimilar materials including metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent, according to Master Bond. The hardened material is an excellent electrical insulator. Both parts A and B are clear in color. Polymer System EP30-1 is widely used in the fiber optics field for applications ranging from bonding ferrules and connectors to potting LED devices as well as fiber optics components.