For industrial micromachining applications, Lumera Laser GmbH has introduced its Hyper-Rapid picosecond lasers with up to 50 W of average power and pulse repetition rates of up to 1 MHz. More than 10 mm3 of material can be ablated coldly, without thermal side effects and with no heat-affected zone, cracks or burr at the edges. A picosecond TEM00 laser beam can be focused to submicron diameter, and each controllable single picosecond pulse will gently remove a layer of material with 10-nm depth control. The pulses have up to 125 μJ of energy, and peak power is in the 10-MW range. Beam quality is M2 <1.5 at 1064 nm and M2 <1.2 at 532 nm.