Request InfoSCHOTT North America Inc.Designed for optoelectronics applications, the AF 32 glass introduced by Schott North America Inc. is suitable for use in the wafer-level chip scale packaging and optics markets. Its coefficient of thermal expansion matches that of silicon, helping to prevent warp during the manufacture of complex assemblies and during reflow, when a wafer-level chip scale packaging imager is attached to a printed circuit board. Thicknesses range from 0.1 to 1.1 mm, and the fire-polished surface of the glass achieves a roughness value below 1 nm rms, eliminating the need for fine mechanical polishing. AF 32...See full productRelated content from Photonics MediaWEBINARSPhotonics.com 1/9/2023Innovations in Ultrashort-Pulse and RF-Excited CO2 Lasers Expand Materials Processing ApplicationsIndustrial laser materials processing is constantly evolving. Industries as varied as pharmaceutical, consumer electronics, automotive, aerospace, and textiles, among others, have benefited from new...Photonics.com 10/27/2021Fiber Optic Solutions for Medical DevicesSteve Allen provides a brief overview and examples of procedures that continue to push adoption and proliferation of optical fiber-based medical devices. From cosmetic surgery to cutting-edge sensing...Photonics.com 6/30/2021European Photonics Manufacturing Services Funded by ECThis event is supported by the European initiatives presented and is moderated by EPIC, the European Photonics Industry Consortium. The European Commission is helping companies access the...Photonics.com 3/7/2019In Vivo Medical Laser Procedures: An OverviewThis webinar, presented by OFS, will provide an overview of current in vivo medical procedures performed using lasers and optical fibers. The presentation will begin with a brief history of...