Nextreme Thermal Solutions Inc. has unveiled the microscale ultrahigh packing fraction OptoCooler module for cooling and temperature control requirements in optoelectronic and medical applications. The device removes a maximum of 420 mW of heat at a 25 °C ambient temperature in an active footprint of 0.55 mm2. As a result, the module can pump a heat density up to 78 W/cm2. At 85 °C, these values increase to 610 mW and 112 W/cm2, respectively. The instrument can be integrated directly into electronic and optoelectronic packaging.