The IX-4000 series Class 1 laser workstations have been unveiled by JP Sercel Associates (JPSA). The series comprises two systems: the IX-4100 ChromaDice and the UV excimer-based IX-4600 ChromAblate laser system. Both perform automated processing of up to 300-mm wafers. The former is suitable for wafer singulation applications, and the latter, for LED production, selective wafer annealing, microdrilling, 3-D micromachining and thin-film patterning. Features include automatic wafer loading, an integrated automated coating/cleaning station and a vision system for automatic wafer alignment. The systems use UV laser energy in a fast low-stress vibration-free method of singulation that minimizes chip breakage after cutting, generates minimal debris and produces higher yields, with kerfs as narrow as 2.5 μm.