Request InfoFor Use as a Thermal Interface MaterialLaird TechnologiesST. LOUIS, July 29, 2008 – Laird Technologies has added the T-flex 700 for use as a thermal interface material to its T-flex gap filler line. The next generation thermal pad increases the thermal conductivity of the line to 5.0 W/mK. The material is highly compliant and allows for thinner interfaces and overall improved thermal performance measured by total thermal resistance. It is naturally adhesive for ease of handling and assembly. Thickness ranges available include 1 to 5 mm in 0.25 mm increments, and it is available in standard sheets or die cut parts that can be custom made to specification. Another option...See full productRelated content from Photonics MediaPRODUCTSPhotonics.com 2/6/2024Lidar OpticsMeller Optics’ lidar optics can be fabricated to match specific military and commercial application requirements. 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