Nov 2008SUSS MicroTec AGRequest Info
Suss MicroTec AG has released the third generation of its manual mask and bond aligner for industrial research and production applications. MA/BA8 Gen3 offers alignment accuracy down to <0.25 μm and easily processes virtually all kinds of wafer and substrate materials up to 200 mm. The high-resolution optics enables patterning of structures below 0.5 μm. The split-field microscope and eyepieces allow direct viewing and/or LCD flat screen options.