Request InfoSUSS MicroTec SESuss MicroTec AG has released the third generation of its manual mask and bond aligner for industrial research and production applications. MA/BA8 Gen3 offers alignment accuracy down to <0.25 μm and easily processes virtually all kinds of wafer and substrate materials up to 200 mm. The high-resolution optics enables patterning of structures below 0.5 μm. The split-field microscope and eyepieces allow direct viewing and/or LCD flat screen options.See full productRelated content from Photonics MediaPRODUCTSPhotonics.com 3/18/2024MicrospectrometersThe Lightblades™ Spectrometers from CRAIC Technologies are specifically designed for microspectroscopy in research, industrial, and academic applications. Covering ultraviolet, visible, and...Photonics.com 3/21/2024Probe MicroscopeThe INX™ 760 from VIAVI is a single, duplex, and multi-fiber probe microscope for reducing time in the construction, activation, and maintenance of complex fiber networks. 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