The DCM 3D from Leica Microsystems GmbH combines confocal microscopy, interferometry and colour imaging into one sensor head. It integrates two CCD cameras, and its software enables 3-D imaging in various colour modes. Jointly developed with Sensofar-Tech, the microscope offers ultrafast and contact-free analysis of the micro- and nanogeometry of material surfaces to an accuracy of 0.1 nm. In seconds it can measure parameters such as roughness and silicon surface texture, and it can provide statistics for etched pyramid structures and metal contacts. It is suitable for research and development, quality assurance laboratories, online process control and quality control of solar cells.