Oct 2009Plasma Etch Inc.Request Info
Plasma Etch Inc. has introduced a reactive ion etching (RIE) version of its BT1 plasma system. The BT1-RIE performs fast anisotropic removal of photoresist, nitrides, oxides, polyimides and diamondlike carbon films. It includes a water-cooled RIE electrode for processing multiple substrates up to 1 sq ft per load cycle. The system uses a 1250-W 13.56-MHz radio-frequency power supply with automatic matching for high-rate etching. It is supplied standard with two mass flow controllers for two gases, with up to four gas channels available optionally. Up to 20 process sequences can be stored, and dual steps can be programmed for automatic processing. Two-stage vacuum pumping is included, with blower packages optional.