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EP21FL Epoxy System

Photonics.com
Mar 2010
Master Bond Inc.Request Info
 
HACKENSACK, N.J., March 15, 2010 – Master Bond Inc.’s  is a two-part epoxy resin system that features low to moderate viscosity. It is suitable for potting, coating and sealing electronic assemblies and for bonding dissimilar substrates with different coefficients of expansion.

Typical viscosity of Part A (clear) is 4000 cyles/s and, of Part B (amber), 10,000 cycles/s, at 25 ºC. The system produces strong castings, bonds and seals that are resistant to thermal cycling and shock. Its bond strength is >1500 lb/sq in., and its tensile strength is >1100 lb/sq in. The hardened compound is an electrical insulator and is available in ½-pint, pint, quart, and 1- and 5-gallon container kits.

It cures at room temperature and, more quickly, at elevated temperatures, with a 4:1 mix ratio by weight. It is 100% reactive and contains no solvents or other volatiles.


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