Request InfoValley Design Corp., HeadquartersValley Design Corp. has developed ultrathin silicon and GaAs wafers with precision-lapped, polished or chemically etched circuitries. Wafers as thin as 10 µm may be obtained. The company specializes in tight thickness specifications and fine polishing.See full productRelated content from Photonics MediaWEBINARSPhotonics.com 10/27/2021Fiber Optic Solutions for Medical DevicesSteve Allen provides a brief overview and examples of procedures that continue to push adoption and proliferation of optical fiber-based medical devices. From cosmetic surgery to cutting-edge sensing...Photonics.com 6/30/2021European Photonics Manufacturing Services Funded by ECThis event is supported by the European initiatives presented and is moderated by EPIC, the European Photonics Industry Consortium. The European Commission is helping companies access the...Photonics.com 3/7/2019In Vivo Medical Laser Procedures: An OverviewThis webinar, presented by OFS, will provide an overview of current in vivo medical procedures performed using lasers and optical fibers. The presentation will begin with a brief history of...Photonics.com 7/22/2021STANDARDS UPDATE: Vision Standards: An Overview of Global and A3 DevelopmentsStandards play a key role in the vision and imaging industry by ensuring interoperability of components, increasing market size, and shortening the time it takes to get new products to market. As the...COMPANIESPhotonics Buyers' GuideValley Design Corp., HeadquartersSince 1975 Valley Design Corp. has been an industry leader in advanced materials processing, as providers of precision lapping, polishing, dicing, 4- and 5-axis CNC machining, grinding, core drilling...