SAN DIMAS, Calif., June 9, 2010 — Craic Technologies Inc. has announced the 20/20 Film microspectrophotometer that is designed to measure the thickness of thin films of submicron sampling areas rapidly and nondestructively. Able to analyze films of many materials on both transparent and opaque substrates, it enables the user to determine thin film thickness on semiconductors, microelectromechanical systems devices, hard disk drives and flat panel displays. The microspectrophotometer also can be configured for contamination imaging, analysis, concentration and relative intensity mapping. The system combines advanced microspectroscopy with sophisticated software to enable the user to measure film thickness by either transmission or reflectance of many types of films and substrates. Sampling areas can range from >100 µm to <1 µm. Designed for the production environment, it incorporates a number of easily modified processing recipes, the ability to create new film recipes, and sophisticated tools for analyzing data as well as options for automation including touch screen control. The ability to directly image and analyze films with ultraviolet, visible and near-IR microscopy can be added to the instrument.