Laird Technologies Inc. has released the enhanced Tlam SS LLD for use as a thermally conductive printed circuit board (PCB) substrate. The versatile, thermally enhanced PCB substrate system is designed for heat dissipation in bright and ultrabright LED module applications. The substrate provides eight to 10 times the heat dissipation as compared with conventional FR4-based PCBs, a key ability in keeping components cool. The boards are processed through standard pick-and-place surface mount technology and manual wire bond operations. Standard constructions are made with 1- or 2-oz copper and 1- or 1.5-mm-thick aluminum, grade 5052; 1- or 1.6-mm-thick aluminum, grade 6061. A copper base is available.