GARBSEN, Germany, June 29, 2010 — LPKF Laser & Electronics AG has introduced an economical cutting laser for use in industrial printed circuit board (PCB) manufacturing. The MicroLine 1000 S is used for depaneling and UV laser cutting of assembled PCBs. The UV laser can cut substrates located right next to delicate components or circuit paths without causing any mechanical stress or thermal interference, enabling production of small subassemblies with high densities. The tool-less method makes any contour possible. Changes to the cutting paths are made via programming the included software or right in the CAD software. The system is suitable for cutting break-out tabs and complex contours with high accuracy. The UV laser makes clean, burr-free cuts in FR4, FR5, CEM, ceramic, polyimide, polyester and other PCB substrates. It cuts PCBs measuring up to 250 × 350 mm. With a focus width of 20 µm, the beam cuts very narrow channels and accommodates tight radii. Laser power measurement occurs at the laser source and at the PCB surface for secure cutting. With the specialized laser source and a compact control panel with a touch screen and easy-to-use software, the system operates at the push of a button. Optimal focus of the beam adjusts automatically. The system uses fiducials, board edges or break-out tabs to identify the position of the PCBs. The laser operates at 355 nm at 5 W. The system measures 875 × 1430 × 750 mm, weighs 260 kg and is air-cooled.