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DICING SERVICES

Photonics Spectra
Aug 1999
Valley Design Corp., HeadquartersRequest Info
 
Valley Design Corp. is offering precision dicing services for both R&D and high-volume requirements. The company's saws can handle materials such as silicon wafers, sapphire and quartz discs, silicon carbide, ferrites and ceramics, as well as compound semiconductors like GaN and InP with diameters up to 6 in. Dicing kerf can be as small as 1 mil and die size as small as 5 mils square.


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