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Secured Diamond Saw Wire

Photonics Showcase
Sep 2010
Niabraze LLCRequest Info
 
High-tensile-strength fixed-grain diamond saw wire for cutting precious, hard materials with minimal material kerf loss. Wire diameter ranging from 140 to 350 μm for applications ranging from wafering to sampling to cropping. Diamond concentricity and density carefully controlled to ensure efficient free cutting. Slurry-free cutting of silicon, sapphire, quartz, germanium, SiC, ceramics and many more materials.


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GLOSSARY
cutting
The process of forming a lens to a given pattern, or of cutting a piece of glass along the line of scratch.
germanium
A crystalline semiconductor material that transmits in the infrared.
quartz
See crystal quartz; fused quartz.
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