SAN JOSE, Calif., Dec. 20, 2010 — X-Scan Imaging Corp. has announced a new member of its family of high-energy line-scan cameras designed for imaging ultrahigh-energy x-ray and gamma ray applications at energy levels to 15 MeV. Designated the XMH8800 series, the cameras combine scintillation for converting high-energy photons to visible light and fiber optics for subsequently conveying the visible light to an off-axis CMOS diode array detector. A lead or tungsten body shields the diode array and integrated electronics, ensuring long-life reliability under extreme radiation conditions. The cameras’ high-energy accelerators and detectors image large, dense objects such as metal castings, and steel objects from 4 to 12 in. thick. Other applications include radiography and nondestructive test imaging. Standard models are available in active sensor lengths ranging from 154 to 3686 mm, including a broad mix of resolutions ranging from 96 to 9216 pixels on centers as small as 400 µm. Other detector lengths can be special ordered with virtually no maximum length limit. The cameras incorporate proprietary CMOS silicon imaging detector array chips with on-chip fully integrated signal processing circuits designed for visible wavelength and x-ray-sensitive applications. The proximity of the analog-to-digital converters to the detector chips and the use of low-voltage differential-signal technology help to minimize noise and maximize bandwidth. High-sensitivity and high-speed readout at up to 9000 lines/s enables inspection speeds >100 cm/s. Typical dynamic range is 4000 to 1. Each camera includes a contiguous linear array of photodiodes, low-noise signal-processing circuitry, 16-bit analog-to-digital converters, digital control, and a choice of either Camera Link or Gigabit Ethernet interface to a remote (supplied separately or by the user) PC-based data acquisition system. The Gigabit Ethernet interface supports cable lengths up to 90 m. A segmented CdWO4 (CWO) crystal array is mated to a fiber optic faceplate that is then mated to the surface of the detector array(s). This structure converts x-ray photons into visible light that is sensed by the linear array of CMOS photodiodes. Various scintillation materials and a range of thicknesses can be provided for optimizing both detector sensitivity and image resolution. The camera includes an x-ray camera head, a Camera Link/Gigabit Ethernet interface box, a power adapter, cabling and a proprietary software development kit that is supplied with software drivers, an intuitive application programming interface and example code software that enables rapid development of nondestructive testing and other x-ray scanning systems. Other scintillators and custom camera geometries are available as an option for special performance and energy range requirements. Other applications include computed tomography, industrial inspection, package content inspection, and security and cargo screening.