Search Menu
Photonics Media Photonics Buyers' Guide Photonics EDU Photonics Spectra BioPhotonics EuroPhotonics Industrial Photonics Photonics Showcase Photonics ProdSpec Photonics Handbook
More News
Email Facebook Twitter Google+ LinkedIn

  • Mosaic 532-11 Industrial Laser
Jan 2011
Spectra-PhysicsRequest Info
SANTA CLARA, Calif., Jan. 17, 2011 — Spectra-Physics, a Newport Corp. Brand, has introduced the Mosaic 532-11, a Q-switched diode-pumped solid-state industrial laser. The all-in-one 532-nm laser combines the head and power supply into a single package, making it easy to integrate into machine tools and onto gantry systems.

It outputs >11 W and delivers short pulse widths of <15 ns and high peak power, and it can operate at high repetition rates, resulting in higher throughput, while minimizing undesirable thermal effects. It offers good near- and far-field beam-pointing stability and good pulse-to-pulse stability for consistent processing results and higher yields.

Features include E-Pulse programmable pulse energy, double the industry average diode life, a field-replaceable laser output window that corrects for burn spots caused by airborne particulates, EternAlign optics that eliminate potential damage, and data logging and product traceability over the life of the device.

Reliable, efficient and cost-effective, the laser is suitable for use in microelectronics and photovoltaics manufacturing, and other demanding processes that require 24/7 operation.

Microelectronics applications include de-paneling or singulating printed circuit boards (PCBs), structuring and ablating materials on PCBs, scribing ceramics and de-flashing electronic package leads. Key photovoltaic applications include edge isolation of crystalline silicon wafers, and scribing P2 and P3 layers on thin-film solar panels.


* Message:
(requirements, questions for supplier)
Your contact information
* First Name:
* Last Name:
* Email Address:
* Company:
Address 2:
Postal Code:
* Country:
Phone #:
Fax #:

Register or login to auto-populate this form:
Login Register
* Required
The process of perforating a silicon or ceramic substrate with a series of tiny holes along which it will break. Nd:YAG or CO2 lasers are now routinely used.
Terms & Conditions Privacy Policy About Us Contact Us
back to top

Facebook Twitter Instagram LinkedIn YouTube RSS
©2016 Photonics Media
x We deliver – right to your inbox. Subscribe FREE to our newsletters.