Film Thickness Measurement Tool
Jul 2011CRAIC TechnologiesRequest Info
SAN DIMAS, Calif., July 11, 2011 — For the semiconductor industry, Craic Technologies Inc. has developed the 20/20 XL, a film thickness measurement tool. It is a microspectrophotometer designed to nondestructively spectrally analyze and image microscopic areas of very large samples.
Thin-film thickness can be measured in both transmission and reflectance. The system also measures the Raman spectra of microscopic samples and performs ultraviolet and near-infrared microscopy of semiconductor and other types of samples. Applications include mapping thin-film thickness of large devices, locating and identifying contaminants, and measuring strain in silicon.
The system offers a full microscopy suite and can be operated manually or automatically. There is no upper limit to the sample size, making it suitable for measuring everything from quality control of the largest flat panel displays to film thickness of 300-mm wafers.
The microspectrophotometer offers an advanced film thickness measurement unit, a Raman spectrometer, a UV-VIS-NIR range microscope, high-resolution digital imaging and powerful, easy-to-use software. It is designed to attach to large frames that can accommodate large-scale samples. It acquires data from microscopic features of samples by absorbance, reflectance or luminescence spectroscopy.
With the high-resolution digital imaging, the instrument can be used as an ultraviolet or infrared microscope. The company’s Apollo Raman spectroscopy modules may be added so the user may also acquire small spot Raman spectra. Touch screen controls and calibrated variable apertures enhance microanalysis.