For the semiconductor industry, Craic Technologies Inc. has developed the 20/20 XL, a film thickness measurement tool. The microspectrophotometer nondestructively analyzes and images microscopic areas of very large samples. Thin-film thickness can be measured in both transmission and reflectance. The system measures the Raman spectra of microscopic samples and performs ultraviolet and near-infrared microscopy of semiconductor and other types of samples. Applications include mapping thin-film thickness of large devices, locating and identifying contaminants, and measuring strain in silicon. The system offers a full microscopy suite and can be operated manually or automatically. There is no upper limit to the sample size, making it suitable for everything from quality control of the largest flat panel displays to measuring film thickness of 300-mm wafers.